发明名称
摘要 <p>An apparatus for cutting liquid crystal display panels and a cutting method using the same are disclosed in the present invention. The apparatus includes a first scribing unit sequentially forming a plurality of first scribing lines on surfaces of first and second mother substrates having unit liquid crystal display panels and cutting the first and second mother substrates along the first scribing lines, a first turning unit turning the cut first and second mother substrates by 90°, and at least two second scribing units sequentially forming a plurality of second scribing lines on the surfaces of the first and second mother substrates and cutting the first and second mother substrates along the second scribing lines.</p>
申请公布号 JP4187543(B2) 申请公布日期 2008.11.26
申请号 JP20030035995 申请日期 2003.02.14
申请人 发明人
分类号 C03B33/03;G02F1/13;B26F1/18;B26F3/00;C03B33/033;C03B33/037;G02F1/1333;H01L21/301 主分类号 C03B33/03
代理机构 代理人
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