发明名称 Thermally stable diamond bonded materials and compacts
摘要 Thermally stable diamond bonded materials and compacts include a diamond body having a thermally stable region and a PCD region, and a substrate integrally joined to the body. The thermally stable region has a microstructure comprising a plurality of diamond grains bonded together by a reaction with a reactant material. The PCD region extends from the thermally stable region and has a microstructure of bonded together diamond grains and a metal solvent catalyst disposed interstitially between the bonded diamond grains. The compact is formed by subjecting the diamond grains, reactant material, and metal solvent catalyst to a first temperature and pressure condition to form the thermally stable region, and then to a second higher temperature condition to both form the PCD region and bond the body to a desired substrate.
申请公布号 GB2413813(B) 申请公布日期 2008.11.26
申请号 GB20050009247 申请日期 2005.05.06
申请人 SMITH INTERNATIONAL INC 发明人 STEWART MIDDLEMISS
分类号 E21B10/573;B01J3/06;B22F7/06;C01B31/06;C22C26/00;E21B10/36;E21B10/46;E21B10/56;E21B10/567 主分类号 E21B10/573
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