| 摘要 |
<p>Hollow cylindrical glass capsules for electronic applications are obtained by sealing the open end of the prepared capsule in a gas tight chamber by means of localized that applied to the upper end of the vertically mounted capsule, and lowering into it an upper wire with a spring connection for the inside contact and a ring shaped glass bead onto which the lip formed on heating the upper rim of the glass shrinks. An increase in the gas pressure in the vessel is then applied causing the joining of the bead and cylinder wall to form an integral seal.</p> |
