| 摘要 |
<p>The method involves arranging electrically leading conducting paths (13) on a circuit carrier. The conducting paths are compressed with stamping process by a punching die (21) through shape-adapted die plate channel (22) of a blanking die (9). An adhesive tape (2) within the emission area of the die plate channel is bypassed to the die plate channel. The adhesive tape is compressed by a press stamp (11) of a punching press (8) against the punched conducting paths for application on adhesive tape. An independent claim is also included for a device with a circuit carrier.</p> |
