| 摘要 |
The optionally porous, back metal 11 substrate is coated 12 or impregnated with a polymeric solution. The solvent is dried 13 using electromagnetic waves. The component is then baked in a furnace 15. The electromagnetic waves are preferably infrared (IR). Disclosed coatings include polyetetrafluoroethylene (PTFE), polyether ether ketone (PEEK), polyimide, polyether sulphone (PES), polyphenylene sulphide (PPS) and polyoxymethylene (POM). The disclosed substrate comprises sintered copper alloy powder on steel. The radiation may be produced by a halogen, xenon or mercury lamp. Disclosed solvents include toluene, methyl-pyrrolidone (NMP), xylene, methyl ethyl ketone (MEK) and dimethylacetamide (DMAC). The resin may also contain graphite and molybdenum sulphide. |
