发明名称 |
Exposure device, exposure method, and semiconductor device manufacturing method |
摘要 |
To provide an exposure apparatus and an exposure method able to correct an image-placement error during an exposure which is unable to decrease only by correcting electron beam description data of a mask pattern, and a semiconductor device manufacturing method used the same, wherein an image placement R 2 of a mask is measured at an inversion posture against an exposure posture (ST 7 ), the measured image placement R 2 is corrected with considering a pattern displacement caused by gravity at the exposure posture and a first correction data Delta 1 is prepared based on a difference of the corrected image placement and a designed data (ST 10 ), and an exposure is performed by deflecting charged particle beam to correct a position of a pattern to be exposed to a subject based on the first correction data Delta 1 (ST 13 ).
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申请公布号 |
US7456031(B2) |
申请公布日期 |
2008.11.25 |
申请号 |
US20050534917 |
申请日期 |
2005.09.26 |
申请人 |
SONY CORPORATION |
发明人 |
OMORI SHINJI;MORIYA SHIGERU;NOHDO SHINICHIRO |
分类号 |
G03F7/20;H01J37/304;H01J37/305;H01J37/317;H01L21/027;H01L21/66 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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