| 摘要 |
An insulating resin layer 50 is formed on a surface of a conductor portion 2 by performing a plating pretreatment to the conductor portion 2 that has been formed on a surface of a wiring board substrate 1 , and forming numerous dendrites 3 on the surface of the conductor portion 2 using an electroplating or chemical plating method. The insulating resin layer 50 is then formed by stacking an insulating resin plate 50 that has a semi-cured adhesive layer 40 formed thereon in advance on the conductor portion 2 and the dendrites 3 , and then applying pressure and raising temperature for laminate bonding.
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