发明名称 Cationically photocurable epoxy resin compositions
摘要 The present invention provides a cationically photocurable epoxy resin composition, which contains (a) an epoxy resin component comprising an alicyclic epoxy resin and an aromatic-ring containing epoxy resin, (b) a cationic photoinitiator component, and (c) a filler selected from oxides, hydroxides and carbonates containing a Group II element. This composition exhibits improved adhesive strength to a glass such as an alkali glass, particularly a sodium-containing glass, or a metal.
申请公布号 US7456230(B2) 申请公布日期 2008.11.25
申请号 US20040514838 申请日期 2004.11.18
申请人 HENKEL CORPORATION 发明人 GAN YOKE AI;CHEN CHUNFU;TERADA KAZUYO
分类号 C08L63/00;C08G59/68;C08K3/22;C08K3/34;C09D163/00;C09J163/00;C09J163/02;C09J163/04;G03F7/038 主分类号 C08L63/00
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