| 摘要 |
The guide hole damage of the lead frame generated in the trim process of the semiconductor package process can be prevented. The die of the trim apparatus for the dam bar comprise as follows. A plurality of pilot pins(20) is for setting the lead frame corresponded to the exhaust region of die(20), protruded on the upper part of die. The pinning block has a pilot pin(20) flowing to the width direction of the lead frame(30) and the pinhole. The die body(50) has the block mounting groove for the pinning block(30). The spring(75) is inserted in the projection bar supported by the bottom body(70). The pinning block(30) has the protrudent part extended to the width direction.
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