| 摘要 |
A polishing pad cleaner of a chemical mechanical polishing apparatus throughly and efficiently cleans the polishing pad of the apparatus. The head of the polishing pad cleaner includes a nozzle support plate, a plurality of nozzles mounted to the nozzle support plate, and extending from the bottom of the nozzle support plate, and partitions interposed between the nozzles. The head is placed over the polishing pad. Subsequently, the polishing pad is roated relative to the nozzles, and cleaning agent is ejected from the nozzles. The partitions help maintain the pressure of the cleaning agent as the agent flows from the nozzles to the polishing pad. Also, different types of cleaning agents can be simultaneously ejected from the nozzles, respectively, onto the polishing pad. Specifically, a high pressure gas and a cleaning solution can be directed onto the same region of the pad one after the other.
|
