Memory module assembly including a clip for mounting a heat sink thereon

摘要

A memory module assembly includes a printed circuit board ( 10 ) having a heat-generating electronic component ( 14 ) thereon, and first and second heat-dissipation plates ( 20 ), ( 30 ) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook ( 24 ) extending from a side thereof and the first hook includes a resisting portion ( 242 ) extending from an end of the first heat-dissipation plate and a first engaging portion ( 244 ) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion ( 34 ) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.