| 摘要 |
A coating apparatus of adhesive and a die bonding apparatus having the same are provided to coat the adhesive regardless of the die size. A coating apparatus of adhesive comprises the storage(100) storing the adhesive resin which uses when adhering the die separated from the discrete chip to the substrate; the showerhead(12) capable of adjusting the position and the amount of adhesive which is to be coated onto the substrate regardless of the die size. The showerhead comprises a plurality of slit nozzles which are replaceable. The showerhead includes the slit nozzle(12a) which is possible for the minute coating of the adhesive resin.
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