发明名称 |
ANALYZING METHOD AND ANALYZING APPARATUS |
摘要 |
An analyzing apparatus is provided with a first processing section for removing a film formed on a substrate by applying ultraviolet; a second processing section for dissolving a material to be analyzed on the substrate by supplying the surface of the substrate with a dissolving solution; and a third processing section for analyzing the material to be analyzed in the dissolving solution used in the second process.
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申请公布号 |
KR20080102210(A) |
申请公布日期 |
2008.11.24 |
申请号 |
KR20087022798 |
申请日期 |
2007.06.21 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
DOBASHI KAZUYA;KAWAMURA SHIGERU;TSUGITA KOHEI;HAYASHI TERUYUKI |
分类号 |
H01L21/66;G01N21/33 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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