| 摘要 |
A release apparatus of carrier module is provided to steadily test semiconductor devices by minimizing a large-size of a release unit. A release apparatus of carrier module comprises the followings: a frame(4) having a plurality of carrier modules, and holding the test tray; a release unit(3) including a release pin(31) releasing the carrier module, and forming the release area(B) for releasing the carrier module; a transport unit(5) successively positioning the carrier module of the test tray at the release area, and moving the frame; and a main body(2) combining the transport unit. The transport unit moves the test tray from the inner side of the main body to outer side of the main body. The release unit is combined in the main body. |
