DIMPLE INSPECTION APPARATUS OF PRINTED CIRCUIT BOARD AND METHOD THEREOF

摘要

A dimple inspection apparatus and method is provided to reduce the amount of detection due to diffuse reflection and oxidation since the surface state of the printed circuit board is inspected after being contacted directly. In dimple inspection apparatus of the printed circuit board(2), a probe(4) is directly contacted with the printed circuit board and moves to the phase / according to the surface step of the printed circuit board. A transducer(6) converts up/down movement into the voltage signal. A display unit(8) converting the voltage signal of the transducer into the surface shape and displays the surface state of the printed circuit board. A part contacted with the printed circuit board of a probe on which the scratch prevention material is formed.