SURFACE TREATMENT FOR MULTI-LAYER WAFERS FORMED FROM LAYERS OF MATERIALS CHOSEN FROM AMONG SEMICONDUCTING MATERIALS,申请号KR20067011259-传众专利搜索

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发明名称	SURFACE TREATMENT FOR MULTI-LAYER WAFERS FORMED FROM LAYERS OF MATERIALS CHOSEN FROM AMONG SEMICONDUCTING MATERIALS
摘要
申请公布号	KR100869399(B1)	申请公布日期	2008.11.21
申请号	KR20067011259	申请日期	2006.06.08
申请人		发明人
分类号	H01L21/20;H01L21/324;H01L21/762	主分类号	H01L21/20
代理机构		代理人
主权项
地址

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