| 摘要 |
A probe apparatus is provided to reduce the latency time of the probe main body using the empty substrate holding member. The probe apparatus examines the electrical characteristic of the IC chip on wafer using the probe card. The probe apparatus comprises the load port(11) loading the carrier in which a plurality of wafers(W) are contained; the plurality of probe main bodies including the probe card in which probe is formed on lower-part; the substrate transfer apparatus for having between the load port and the probe main body and performing the transfer of wafer. The substrate transfer apparatus is arranged around the vertical axis and freely rotates and go up/down. |
