METHOD FOR MEASURING ADHESION OF CIRCUIT PATTERN

摘要

An adhesive strength measuring method is provided to remove the degradation of adhesion strength due to the plating liquid penetration and circuit pattern since copper electrolytic coating is not performed. An adhesive strength measuring method of the circuit pattern is comprised of steps: adhering to the adhesive member having the predetermined adhesion to the circuit pattern(S100); peeling off one end of the adhesive member to the other end(S110); judging whether the residue exist on the circuit pattern or not(S120); measuring the adhesive force of the circuit pattern according to the decision result(S130). A substrate is made of at least, a one of the BT(Bismaleimide Triazine) resin, and epoxy or polyimide.