| 摘要 |
A semiconductor chip bonding system is provided to bond a semiconductor chip by penetrating the laser beam on the semiconductor chip and directly heating up a junction portion. A semiconductor chip bonding unit is prepared. A laser generator penetrates a laser beam into a semiconductor chip and irradiates directly the laser beam on a bump. A scan head(20) focuses the laser beam from the laser generator to irradiate the beam at the bump. A stage is for mounting a substrate. The laser beam has 1064nm wavelength. Load glass is positioned on the semiconductor chip. The load glass is preheated through a pre-heater. The controller controls the laser generator, and the stage and scan head. The laser generator comprises a beam expander for enlarging the laser beam. The controller controls the scan speed and the scan head.
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