MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD USING ELECTROLYTIC PLATING LEAD

摘要

The method for manufacturing a semiconductor package board having no plating lead line is provide to form the fine pattern by using the MSAP(Modified Semi-Additive Process) process. The drilling process is for forming a plurality of through holes on the copper laminate(1) formed on the processed base substrate. The copper plating process is for forming the seed layer layer(3) on the entire surface of the base substrate. The pattern plating process is for performing the patten plating(4) in the first masked substrate. The first stripping process is for removing the dry film masking formed on the substrate after the pattern plating process. The second masking process is for laminating the dry film onto the substrate and performing exposing and developing after the first stripping process. The second flash etching process is for etching the second masked substrate by using the solution of HF type. The second stripping process is for removing the second masking by using the stripper solution after the second flash etching process. The third masking process is for exposing and developing by masking using the dry film. The gold coating(6) process is for the electrolytic gold plating on the solder ball pad and wire bonding pad. The third flash etching process is for etching the gold-plated substrate using the solution of HF type. The solder resist process is for coating the appointed area of the gold-plated substrate and exposing and developing and drying..