Electronic Device Comprising a Mems Element

摘要

The device ( 100 ) comprises a MEMS element ( 60 ) in a cavity ( 30 ) that is closed by a packaging portion ( 17 ) on a second side ( 2 ) of the substrate ( 10 ). Contact pads ( 25 ) are defined on a flexible resin layer ( 13 ) on an opposite first side ( 1 ) of the substrate. Electrical connections ( 32 ) extend through the resin layer ( 13 ) to at least one element of the device ( 100 ). The device ( 100 ) is suitably made with the use of a temporary carrier ( 42 ), and opening of etching holes ( 18 ) from the second side ( 2 ) of the substrate ( 10 ).