| 摘要 |
The photoelectric circuit board according to the present invention is a photoelectric circuit board, wherein a rigid portion where at least a conductor circuit and an insulating layer are formed and layered and one or more flex portions that are bendable are integrated, external connection portions for mounting an optical element and/or a package substrate on which an optical element is mounted are formed in above-described rigid portion, and an optical circuit is formed in at least one of above-described flex portions.
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