发明名称 |
Monitoring Cool-Down Stress in a Flip Chip Process Using Monitor Solder Bump Structures |
摘要 |
A semiconductor chip and methods for forming the same. The semiconductor chip includes M regular solder bump structures and N monitor solder bump structures, M and N being positive integers. If a flip chip process is performed for the semiconductor chip, then the N monitor solder bump structures are more sensitive to a cool-down stress than the M regular solder bump structures. The cool-down stress results from a cool-down step of the flip chip process. Each of the M regular solder bump structures is electrically connected to either a power supply or a device of the semiconductor chip. Each of the N monitor solder bump structures is not electrically connected to a power supply or a device of the semiconductor chip.
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申请公布号 |
US2008286886(A1) |
申请公布日期 |
2008.11.20 |
申请号 |
US20070749885 |
申请日期 |
2007.05.17 |
申请人 |
CAREY CHARLES F;HANSEN BERNT JULIUS;MALHOTRA ASHWANI K;QUESTAD DAVID L;SAUTER WOLFGANG |
发明人 |
CAREY CHARLES F.;HANSEN BERNT JULIUS;MALHOTRA ASHWANI K.;QUESTAD DAVID L.;SAUTER WOLFGANG |
分类号 |
H01L21/66;H01L23/58 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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