发明名称 RESIN COMPOSITION, DRY FILM, AND FABRICATIONS OF THE SAME
摘要 <p>The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent severe demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.</p>
申请公布号 WO2008139720(A1) 申请公布日期 2008.11.20
申请号 WO2008JP01129 申请日期 2008.04.30
申请人 MITSUI CHEMICALS, INC.;FUNAKI, KATSUHIKO;OHKAWADO, ETSUO;HIROTA, KOUSUKE;TAHARA, SYUJI 发明人 FUNAKI, KATSUHIKO;OHKAWADO, ETSUO;HIROTA, KOUSUKE;TAHARA, SYUJI
分类号 C08L79/08;C08K5/5313;C08K5/5399;G03F7/004;G03F7/027;G03F7/037 主分类号 C08L79/08
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