发明名称 |
RESIN COMPOSITION, DRY FILM, AND FABRICATIONS OF THE SAME |
摘要 |
<p>The invention provides a resin composition which develops excellent flame retardance after curing in spite of its being free from halogen-containing compounds and antimony compounds, which are liable to cause environmental load, and which can give a film meeting the recent severe demands for higher flexing resistance and insulation reliability. Specifically, the invention provides a resin composition which comprises (A) a polyimide precursor and (B) an adduct of an organophosphorus compound represented by formula (1) with a compound having four or more (meth)acrylate groups. It is preferable that the resin composition further contain (C) a phosphazene compound.</p> |
申请公布号 |
WO2008139720(A1) |
申请公布日期 |
2008.11.20 |
申请号 |
WO2008JP01129 |
申请日期 |
2008.04.30 |
申请人 |
MITSUI CHEMICALS, INC.;FUNAKI, KATSUHIKO;OHKAWADO, ETSUO;HIROTA, KOUSUKE;TAHARA, SYUJI |
发明人 |
FUNAKI, KATSUHIKO;OHKAWADO, ETSUO;HIROTA, KOUSUKE;TAHARA, SYUJI |
分类号 |
C08L79/08;C08K5/5313;C08K5/5399;G03F7/004;G03F7/027;G03F7/037 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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