| 摘要 |
<p>A temperature control device for handling solder comprises a body (10) of the temperature control device for handling solder (1), a rotating shaft (77) built into the body (10) and rotatable about its axis, a set temperature changing means (75) for changing the set temperature according to the rotation angle of the rotating shaft (77), a rotary knob (20) supported to body (10) so as to be rotatable about the rotating shaft (77), and a temperature lock key (40) insertable into and removable from the body (10) at a coaxial position with the rotating shaft (77) and the knob (20) and, when inserted, mechanically coupling the rotating shaft (77) and the knob (20) so that they rotate interlockingly. While the temperature lock key (40) is removed from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to thereby prohibit the change of the set temperature by the rotation of the knob (20).</p> |
