发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high adherence, small ohmic resistance, and high light extraction efficiency. <P>SOLUTION: This semiconductor device comprises a lamination 20 having a contact layer 17 containing a II-VI group compound semiconductor (e.g. ZnTe, BeZnTe or MgSe), and an upper electrode 18 formed on the top face of the contact layer 17. A concavo-convex portion 17C is formed on the whole top face of the contact layer 17, and the concavo-convex portion 17C has a fine structure wherein a plurality of stripe-shaped convex portions 17D extending in one direction in the lamination surface are arranged in parallel. Thereby, not only the contact area between the contact layer 17 and the upper electrode 18 becomes larger as compared with the case wherein the top face of the contact layer 17 is a flat surface, but also the change of the refractive index in the normal direction in a region opposed to the light emitting region 14A (or an opening portion 18A) in the top face of the contact layer 17 becomes smooth. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008282966(A) 申请公布日期 2008.11.20
申请号 JP20070125525 申请日期 2007.05.10
申请人 SONY CORP;SOPHIA SCHOOL CORP;HITACHI LTD 发明人 KISHINO KATSUMI;NOMURA ICHIRO;YAMAGUCHI KYOJI;NAKAJIMA HIROSHI;NAKAMURA HITOSHI
分类号 H01L33/06;H01L33/22;H01L33/28;H01L33/38;H01L33/42 主分类号 H01L33/06
代理机构 代理人
主权项
地址