| 摘要 |
PROBLEM TO BE SOLVED: To provide a supporter or the like which easily realizes good electrical connection with a printed wiring substrate even if an electric component is warped, enables the electric component to be repaired any number of times without damaging the printed wiring substrate and an adjacent mounting component, realizes easy supply of preliminary solder, easily miniaturizes the printed wiring substrate and improves electrical characteristics. SOLUTION: A supporter 1a is disposed between a printed wiring substrate 10 and an electric component (semiconductor device 11). The supporter has a sheet member 14 having a plurality of through holes 113 which are filled with solder pastes 15a, 15b, 15c inside and a heater circuit (heater element 111) interconnected to enclose a periphery of the through hole 113 inside the sheet member 14 and a voltage applying part 12 for applying a voltage to the heater element 111. The fill of the solder pastes 15a, 15b, 15c is controlled in accordance with a position of the through hole 113 in the sheet member 1a. COPYRIGHT: (C)2009,JPO&INPIT
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