| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting a flexible board or the like, by which the flexible board can be excellently thermocompression-bonded to the terminal part of an electronic device through an anisotropic conductive film without temporary thermocompression bonding. SOLUTION: The method of mounting the flexible board for thermocompression-bonding the flexible board to the terminal part of the electronic device through the anisotropic conductive film includes: a first pressure bonding step of executing pressure bonding at a first temperature to be a melting temperature at which air bubbles are not generated from the anisotropic conductive film and with a first pressurizing force for not generating positioning errors of the flexible board; and a second pressure bonding step of executing pressure bonding following the first pressure bonding step at a second temperature to be a curing temperature for curing the anisotropic conductive film, which is higher than the first temperature, and with a second pressurizing force higher than the first pressurizing force, for turning the terminal part and the flexible board to be conductive by conductive particles of the anisotropic conductive film. COPYRIGHT: (C)2009,JPO&INPIT
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