| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device capable of filling resist to the bottom of grooves and providing the resist so that a filling rate of the resist into the grooves in the whole area of a substrate becomes high, upon bonding the film type resist to the semiconductor substrate having fine grooves on the surface thereof. SOLUTION: The semiconductor manufacturing device 1 of this invention is provided with at least a chamber 10 equipped with a pressure control means, a flat plate 25, disposing a first semiconductor substrate 2 arranged so as to be superposed sequentially in the chamber while accommodating a first supporting means 20 which builds in a first heating mechanism 21, a second supporting means 23 for retaining the film type resist 3 and a second heating mechanism 24, and a first moving means 26 for controlling the position of the first supporting means 20 into a direction wherein the semiconductor substrate is pushed against the flat plate through the resist or a direction wherein the pushing is released while the temperature control of the first heating mechanism and the second heating mechanism are effected individually and respectively. COPYRIGHT: (C)2009,JPO&INPIT
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