发明名称 LIQUID COOLING SYSTEM
摘要 In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic system and a closed position to permit installation of a cover on the chassis. Other embodiments are disclosed and claimed.
申请公布号 US2008283218(A1) 申请公布日期 2008.11.20
申请号 US20080047026 申请日期 2008.03.12
申请人 INTEL CORPORATION 发明人 GWIN PAUL J.;LONG BRIAN J.
分类号 F28F7/00;F25D19/00;F25D23/12;G06F1/20;H05K7/20 主分类号 F28F7/00
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