发明名称 |
SEMICONDUCTOR PACKAGE USING CHIP-EMBEDDED INTERPOSER SUBSTRATE |
摘要 |
A semiconductor package using a chip-embedded interposer substrate is provided. The chip-embedded interposer substrate includes a chip including a plurality of chip pads; a substrate having the chip mounted thereon and including a plurality of redistribution pads for redistributing the chip pads; bonding wires for connecting the chip pads to the redistribution pads; a protective layer having via holes for exposing the redistribution pads while burying the chip and the substrate; and vias connected to the redistribution pads through the via holes. The semiconductor package including chips of various sizes is fabricated using the chip-embedded interposer substrate.
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申请公布号 |
US2008283996(A1) |
申请公布日期 |
2008.11.20 |
申请号 |
US20080121490 |
申请日期 |
2008.05.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
O MIN-HO;LEE JONG-HO;AHN EUN-CHUL;KIM PYOUNG-WAN |
分类号 |
H01L23/49;H01L23/538 |
主分类号 |
H01L23/49 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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