| 摘要 |
In one embodiment, the invention has a step of forming an inner layer circuit pattern portion and a lead pattern portion, a step of forming a dummy pattern that indicates the range of the lead pattern portion on the outer layer base material, a step of forming an interlayer adhesive layer on a surface of the outer layer base material where the dummy pattern has been formed, a step of applying, corresponding to the dummy pattern, a resin film to the interlayer adhesive layer, a step of layering the outer layer base material on the inner layer base material via the interlayer adhesive layer with the position of the resin film matched to the position of the lead pattern portion, a step of forming the outer layer circuit pattern portion corresponding to the inner layer circuit pattern portion, and a step of removing the interlayer adhesive layer and the outer layer base material layered on the resin film.
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