| 摘要 |
A wiring board 100 has a multilayer structure in which insulating layers and wiring layers are arranged on upper and lower surfaces of a core substrate 240, and has a via structure 200 in which electrolytic Cu plating is carried out over a via forming opening provided by patterning a resist layer to form a via 220. A through hole 244 and a wiring pattern 210 to be connected to the through hole 244 are formed on the core substrate 240. The via 220 taking a cylindrical shape is mounted on an upper surface of the wiring pattern 210 and a wiring pattern 230 is formed on an upper surface of the via 220. The via structure 200 is constituted by the wiring pattern 210, the via 220 and the wiring pattern 230, and the through hole 244, the wiring pattern 210, the via 220 and the wiring pattern 230 are electrically connected respectively.
|
