发明名称 POLISHING PAD, USE THEREOF AND METHOD FOR MAKING THE SAME
摘要 The present invention mainly relates to a polishing pad that comprises a buffer sheet, a polishing sheet and adhesive for adhering the buffer sheet to the polishing sheet. The buffer sheet comprises fibers. The polishing sheet comprises a first elastomer. The adhesive comprises a second elastomer. A method of polishing a substrate comprising using the polishing pad and a method for manufacturing the polishing pad described above are also provided.
申请公布号 US2008287047(A1) 申请公布日期 2008.11.20
申请号 US20070750352 申请日期 2007.05.18
申请人 SANG FANG CHEMICAL INDUSTRY CO., LTD. 发明人 FENG CHUNG-CHIH;YAO I-PENG;CHAO CHEN-HSIANG;HUNG YUNG-CHANG
分类号 B24D11/00;B24D18/00 主分类号 B24D11/00
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