| 摘要 |
The invention relates to a gyroscope with a vibrating structure, produced by micromachining in a thin wafer, which comprises a movable inertial assembly ( 1 ) comprising at least one movable mass ( 50 ) able to vibrate in the plane of the wafer along a drive axis x and along a sense axis y roughly perpendicular to the x-axis, an interdigital sensor comb ( 90 ) and an interdigital drive comb ( 70 ). It furthermore comprises at least one additional interdigital comb ( 10 a), called the quadrature-error compensation comb, connected to the mass ( 50 ) and which has two asymmetric air gaps e and lambdae, lambda being a positive real number, for subjecting the mass to an adjustable electrostatic stiffness due to coupling between the x-axis and the y-axis by applying a variable DC voltage V to this comb, the adjustable stiffness allowing compensation for the quadrature error of the gyroscope.
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