| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting solder balls that can efficiently and accurately mount solder balls at the spcecified position on a work, and to provide a mounting apparatus. <P>SOLUTION: The periphery of a mask 3 is made higher than a formation area of a ball holding holes 3a, and a work 1 is placed under the ball holding hole 3a of the mask 3. The ball holding hole 3a and an electrode of the work 1 are positioned, and a solder ball B is put on the mask 3, and then the mask 3 is vibrated in that state. The solder ball B is moved on the surface of the mask 3, and it is dropped into the ball holding hole 3a. The periphery of the mask 3 is made lower than the ball holding hole 3a, and the excessive part of the solder ball B is collected from the mask 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
