| 摘要 |
PROBLEM TO BE SOLVED: To fill a recess through a dry process without a space by repeating a film forming process and an etching process simultaneously or alternately. SOLUTION: A recess filling method is carried out in a manner such that a film forming process which forms a metal film 15 on a surface where a recess 12 is formed on a surface of a substrate 11 and an etching process which injects an ion of an etching gas into the metal film are repeated alternately. Since an overhang portion 19, which is formed so as to extrude the recess 12 in the film forming process, is removed in the etching process, the opening of the recess 12 is not closed in the next film forming process, then, it is possible to make the metal film 15 inside the recess 12 grow. COPYRIGHT: (C)2009,JPO&INPIT
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