发明名称 |
COATING APPARATUS AND COATING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a coating head capable of preventing occurrence of solid material or a gel at the tip part of a nozzle, the settling of fine particles due to aggregation or sticking in the nozzle and to suppress occurrence of defects such as coating unevenness or stripes on a coating film on a base material to be coated. SOLUTION: In the coating head having the nozzle for discharging a solution, the settling and the sticking of materials in the nozzle are suppressed by arranging a metallic wire or a metallic plate to which voltage is applied inside the nozzle and applying the voltage of irreversible potential to the nozzle. As a result, the coating apparatus free from occurrence of the defects such as the coating unevenness or the stripes on the coating film on the material to be coated is attained. COPYRIGHT: (C)2009,JPO&INPIT
|
申请公布号 |
JP2008279355(A) |
申请公布日期 |
2008.11.20 |
申请号 |
JP20070125329 |
申请日期 |
2007.05.10 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YAMASHITA HIDEKI;MORITA MASAFUMI;MAEJIMA SATOSHI;HONMA YOSHIYASU |
分类号 |
B05C5/00;B05C11/10;B05D1/26;B05D3/14 |
主分类号 |
B05C5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|