发明名称 High performance system-on-chip using post passivation process
摘要 The present invention extends the above referenced continuation-in-part application by in addition creating high quality electrical components, such as inductors, capacitors or resistors, on a layer of passivation or on the surface of a thick layer of polymer. In addition, the process of the invention provides a method for mounting discrete electrical components at a significant distance removed from the underlying silicon surface.
申请公布号 US2008284032(A1) 申请公布日期 2008.11.20
申请号 US20080186530 申请日期 2008.08.06
申请人 MEGICA CORPORATION 发明人 LIN MOU-SHIUNG
分类号 H01L23/532 主分类号 H01L23/532
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