| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board on which solder is formed to protrude on a surface opposite to a surface on which flow soldering is carried out without carrying out reflow soldering so that the printed circuit board can be grounded to a metal plate via the solder. SOLUTION: The metal plate 19 for grounding a ground pattern 12 of the printed circuit board 10 is disposed on the undersurface 21 of the printed circuit board 10 to which no electronic component is soldered. A mounting screw 18 is put through a hole 15 of the printed circuit board 10 and through a hole 23 of a metal plate 19 and is screwed into a mount body, which is not shown in a figure. As the mounting screw 18 is tightened, a protruding portion 17 of solder 16 formed by flow soldering on an upper surface 20 and protruding outward from the undersurface 21 is squeezed between the printed circuit board 10 and the metal plate 19 to crash. As a result, a contact area between the solder 16 and the metal plate 19 increases, so that the ground pattern 12 can be grounded certainly to the metal plate 19 via the solder 16. COPYRIGHT: (C)2009,JPO&INPIT
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