| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of raising connection reliability in a metallic wire by improving the wire bonding of a semiconductor element resulting from an adhesive layer. <P>SOLUTION: The semiconductor device 1 includes the semiconductor element 5 which is stuck onto the element mounting part 3 of a wiring substrate 2 via the adhesive layer 6. The electrode 7 of the semiconductor element 5 is electrically connected to the connection pad 4 of the wiring substrate 2 via the metallic wire 8. The adhesive layer 6 includes a lamination structure with the first adhesive layer 9 and the second adhesive layer 10. The first adhesive layer 9 includes a fillet part 9b running onto the side surface of the semiconductor element 5. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
