| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing technology with which probe inspection can be performed by an inspection apparatus commonly available for an ordinary LSI chip even in the case of a large-area chip. <P>SOLUTION: A chip is prepared which has a plurality of inspection areas 301 divided by a chip area 202 and includes an element formed by a semiconductor process in an element area 203. Next, pads 101, 102, 103 electrically connected with the element are formed, respectively, at the corresponding positions in the plurality of inspection areas 301. Then, the plurality of inspection areas 301 are inspected through the plurality of pads 101, 102, 103 by the same probe card. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
