ALIGNMENT MARK, SEMICONDUCTOR CHIP INCLUDING THE SAME, SEMICONDUCTOR PACKAGE INCLUDING THE CHIP AND METHODS OF FABRICATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide: an alignment mark; a semiconductor chip including the same; a semiconductor package including the chip and methods of fabricating the semiconductor chip; and the semiconductor package.

SOLUTION: An alignment mark AK includes an align metal pad 14a on a substrate and electrically isolated; a protective film 15 including a first aperture 15a exposing part of the align metal pad; and a metal alignment bump 18a on the align metal pad exposed in the first aperture and protruding above the protective film. The relatively large level of reflection of the metal alignment bump may increase the contrast between the metal alignment bump and the protective film, thereby improving the rate of recognition of the alignment mark when using alignment equipment.

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