发明名称 WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate hard to misidentify a foreign substance as an alignment mark even when a protrusion distance of the alignment mark is small. <P>SOLUTION: A wiring substrate has a conductor wiring 3 formed on a surface of an insulating base material, a protrusion electrode 4 formed over both sides of the conductor wiring across a longitudinal direction of the conductor wiring, a metal pattern 5 formed so as to be extended in the same direction of a part in which the protrusion electrode is formed in the conductor wiring, an alignment mark 6 formed over a region on the insulating base material at both sides of the metal pattern across a longitudinal direction of the metal pattern, and a misidentification detecting pattern 7 formed so that the metal pattern is extended in a shape protruding in a direction across the longitudinal direction of the metal pattern at a position spaced apart from the alignment mark by a prescribed distance. When a foreign substance adjacent to the alignment mark 6 is erroneously recognized, the misidentification detecting pattern 7 is entered in a recognition image 9 to reduce a matching rate with a reference pattern 10 of a recognition apparatus, and as a result, the misidentification caused by the foreign substance can be prevented. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008283130(A) 申请公布日期 2008.11.20
申请号 JP20070128222 申请日期 2007.05.14
申请人 PANASONIC CORP 发明人 SHIMOISHIZAKA NOZOMI;NAGAO KOICHI;NAKAMURA YOSHIFUMI
分类号 H01L23/12;H01L21/60 主分类号 H01L23/12
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