| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for releasing the protective film of an adhesive tape for efficiently releasing the protective film for protecting an adhesive layer, and to provide a method for manufacturing a semiconductor package, where a semiconductor chip can be made to adhere, using a simple process. SOLUTION: At first, a half-cut type cut 90 is formed from the side of the protective film 21, so that the protective film 21 and the adhesive layer 10 are separated into a product part 11 and a frame part 19, but the protective film 22 is not separating. Then, a release tape 6 is stuck onto the protective film 21. The release tape 6 is wound together with the protective film 21, thereby releasing the protective film 21. When the release tape 6 is wound, the frame part 19 of the adhesive layer 10 is also wound together. Consequently, the frame part 19 is separated from the product part 11 in the adhesive layer 10, and then, the protective film 21 is released, in a state where only the product part 11 is left on the protective film 22. COPYRIGHT: (C)2009,JPO&INPIT
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