| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting polyimide resin composition excellent in shelf stability before setting. SOLUTION: The resin composition comprises a polyimide resin and an epoxy resin, provided that the polyimide resin has a structure represented by formula (1) and/or formula (2) and a structure represented by formula (3) (wherein X is a residue from a phenolic compound; Y is a residue from a polyol compound; and Rx<SB>1</SB>-Rx<SB>5</SB>are each a residue from a polyisocyanate compound, provided that one of them is a residue from trimethylhexane diisocyanate). COPYRIGHT: (C)2009,JPO&INPIT
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