LIGHT EMITTING DEVICE AND PACKAGE ASSEMBLY FOR LIGHT EMITTING DEVICE

摘要

Provided is a light emitting device having an upper/lower electrode type light emitting diode on a substrate composed of a ceramic board composed of a metal substrate and a ceramic substrate abutting to the metal substrate. A substrate lead frame for manufacturing the light emitting device is also provided. In the light emitting device, a light emitting section or the like is arranged on a substrate wherein a metal substrate (11) and a ceramic board (12) abut to each other on one side. The ceramic board (12) has a conductive film (17) formed on an upper section. The metal substrate (11) and the ceramic board (12) are bonded with an adhesive such as a thermosetting resin so that a reflection frame (16) composed of an insulating member having an opening section is over the metal substrate and the ceramic board. At least one upper/lower electrode type light emitting diode (13) has a lower electrode on the metal substrate (11) inside the reflection frame (16). At least one conductive connecting member (14) connects an upper electrode (131) of the upper /lower electrode type light emitting diode (13) and the conductive film (17) on the ceramic board (12).