发明名称 LIGHT-EMITTING DEVICE AND BOARD LEAD FRAME FOR MANUFACTURING LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly efficient light-emitting device in which the bottom face of a reflective frame is bonded to a separating portion formed between a first metal board and a second metal board to prevent the backward emission of light from an upper-lower-electrode type light-emitting diode, and to provide a board lead frame for manufacturing the light-emitting device. <P>SOLUTION: According to the light-emitting device, the first metal board and the second metal board are disposed to be opposite to each other through the separating portion, and an insulating film is formed on the surface of the second metal board having a fold-back projection. The reflective frame made of an insulating resin member having an opening is overlaid on the folded back fold-back projection of the second metal board to be bonded over the first and second metal boards. A lower electrode of the upper-lower-electrode type light-emitting diode is mounted on the first metal board through the opening of the reflective frame. An upper electrode of the upper-lower-electrode type light-emitting diode is connected to the fold-back projection of the second metal board through a conductive connection member. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008282917(A) 申请公布日期 2008.11.20
申请号 JP20070124552 申请日期 2007.05.09
申请人 C I KASEI CO LTD 发明人 FUSHIMI KOJI;MATSUSHITA MASAHISA
分类号 H01L33/32;H01L33/44;H01L33/50;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/32
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