发明名称 MULTILAYER WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND PROBE APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board incorporating a resistor having a smaller error to a predetermined value compared with a conventional art, and to provide a method of manufacturing the same and a probe apparatus utilizing the multilayer wiring board. <P>SOLUTION: A multilayer wiring board 12 is based on a basic concept to form a flat surface on a surface of a multilayer wiring layer 16 on which a resistor material is deposited, and to deposit the resistor material on the flat surface. That is, the multilayer wiring board 12 has the multilayer wiring layer 16 on whose surface concave and convex are formed, a dummy layer 32b filled in the concave and convex in a predetermined region of the multilayer wiring layer surface and which has an almost flat surface, a resistor material layer formed by an electric resistance material deposited on the dummy layer and on a region outside the dummy layer, and a wiring which consists of a conductive material deposited on the electric resistance material and reaches a part of the flat surface region of the dummy layer from the region outside the dummy layer. A resistor 40a is formed in a region to which the wiring of the resistor material layer does not reach. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008283131(A) 申请公布日期 2008.11.20
申请号 JP20070128292 申请日期 2007.05.14
申请人 MICRONICS JAPAN CO LTD 发明人 INOUE TATSUO;ARAI OSAMU;MIKUNI KATSUSHI;IMAI NORIHIRO
分类号 H05K3/46;G01R1/073;H01L21/66 主分类号 H05K3/46
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