| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which shortens the connection between a built-in semiconductor element and an upper layer and further, can contain a cheap chip component of general goods on the market whose electrode is formed with tin, nickel and copper, and a low-cost semiconductor element with a bump, such as, a copper bump also. <P>SOLUTION: In the wiring board 1 packaging electronic components of a semiconductor element 3 and a chip component 4, a stopper material 2 for an etchant is formed on a copper foil, at a position corresponding to an electrode of the electronic component; and after the electronic components are packaged, they are laminated through an insulating layer 5. Further, after the copper foil is removed by etching, a wiring is formed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
